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Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation.

, , , , , и . 3DIC, стр. 1-5. IEEE, (2009)

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Chuan-Cheng Tan

Jen-Yang Chuang

Shih-yu Chuang

Mei-Ling Chuang

Jing-Jing Chuang

 

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