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Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation.

, , , , , and . 3DIC, page 1-5. IEEE, (2009)

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Silk piezoelectric thin films: Materials to devices., , , , and . IEEE SENSORS, page 1-3. IEEE, (2016)A low/high band highly linearized reconfigurable down conversion mixer in 65nm CMOS process., , and . NORCAS, page 1-4. IEEE, (2015)Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration., , , , , and . 3DIC, page 1-4. IEEE, (2016)Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC., , , and . 3DIC, page 1-4. IEEE, (2016)Silk Piezoelectric Tactile Sensors: The Way Forward to Developing Intelligent Implantable Sensors., , , , and . ISCAS, page 2225-2228. IEEE, (2022)A low-cost multi-phase 3A buck converter with improved ripple cancellation for wide supply range., , , and . ISCAS, page 1618-1621. IEEE, (2016)Low power reconfigurable multi-mode LNA utilizing subthreshold bias and low-Q inductors., , and . ISCAS, page 650-653. IEEE, (2015)A 1.2V wide-band reconfigurable mixer for wireless application in 65nm CMOS technology., , , and . SoCC, page 49-52. IEEE, (2015)A 2μW biomedical frontend with ΣΔ ADC for self-powered U-healthcare devices in 0.18μm CMOS technology., , , , , , and . NEWCAS, page 1-4. IEEE, (2015)A -34dBm sensitivity battery-less wake-up receiver with digital decoder., , , and . APCCAS, page 721-724. IEEE, (2016)