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7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip.

H. Kim, J. Lim, J. Lee, D. Na, J. Shin, C. Kim, S. Yu, J. Shin, S. Lee, D. Rajagopal, S. Kim, K. Kang, J. Park, Y. Kwon, M. Lee, S. Kim, S. Shin, H. Kim, J. Kim, K. Kim, H. Joo, C. Park, J. Kim, M. Lee, D. Kim, H. Yang, D. Byeon, K. Park, K. Kyung, and J. Choi. ISSCC, page 1-3. IEEE, (2015)

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Jang Woo Seo

Jang-Hie Lee

See-Woo Lee

Woo-Kyun Lee

Won-Woo Lee

Other publications of authors with the same name

Membrane design of vibration transducer to drive round window to increase vibration displacement.J. Lee, H. Lim, E. Jung, K. Seong, J. Lee, J. Kim, M. Kim, and J. Cho. BHI, page 541-543. IEEE, (2012)Measurement of directivity for the design of an implantable microphone implanted under an artificial skin model.E. Jung, D. Shin, K. Seong, J. Lee, J. Lee, H. Cho, M. Kim, and J. Cho. BHI, page 297-300. IEEE, (2012)Body temperature predicting Patch-Type telemedicine system.S. Woo, Z. Mohy-Ud-Din, J. Lee, E. Jung, K. Seong, H. Lim, T. Bae, J. Lee, C. Won, and J. Cho. IEICE Electron. Express, 6 (16): 1161-1167 (2009)Spread spectrum clock generation for reduced electro-magnetic interference in consumer electronics devices.J. Lee, H. Kim, and C. Yoo. IEEE Trans. Consumer Electronics, 56 (2): 844-847 (2010)Estimation Error Bound of Battery Electrode Parameters With Limited Data Window.S. Lee, P. Mohtat, J. Siegel, A. Stefanopoulou, J. Lee, and T. Lee. IEEE Trans. Ind. Informatics, 16 (5): 3376-3386 (2020)7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip.H. Kim, J. Lim, J. Lee, D. Na, J. Shin, C. Kim, S. Yu, J. Shin, S. Lee, D. Rajagopal and 20 other author(s). ISSCC, page 1-3. IEEE, (2015)A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems.J. Lee, D. Na, A. Kavala, H. Cho, J. Lee, M. Yang, E. Song, T. Kim, S. Lee, D. Jang and 16 other author(s). VLSI Circuits, page 1-2. IEEE, (2020)

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Disambiguation of "Lee, Jang-Woo"

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7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip.

Please choose a person to relate this publication to

Jang Woo Seo

Jang-Hie Lee

See-Woo Lee

Woo-Kyun Lee

Won-Woo Lee

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lee, Jang-Woo"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML 7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip.

Please choose a person to relate this publication to

Jang Woo Seo

Jang-Hie Lee

See-Woo Lee

Woo-Kyun Lee

Won-Woo Lee

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
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7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip.