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Integration Method for Electronics in Woven Textiles

, , , , and . IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (7): 1107--1117 (July 2012)
DOI: 10.1109/tcpmt.2012.2189770

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Woven Electronic Fibers with Sensing and Display Functions for Smart Textiles, , , , and . Advanced Materials, 22 (45): 5178--5182 (October 2010)Encapsulation for Flexible Electronic Devices, , , , and . IEEE Electron Device Letters, 32 (12): 1743--1745 (December 2011)Integration Method for Electronics in Woven Textiles, , , , and . IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (7): 1107--1117 (July 2012)A flexible InGaZnO based 1-bit SRAM under mechanical strain, , , , and . 2011 Semiconductor Conference Dresden, IEEE, (September 2011)Weaving integrated circuits into textiles., , , and . ISWC, page 1-8. IEEE Computer Society, (2010)Endurance behavior of conductive yarns., and . Microelectron. Reliab., 54 (1): 327-330 (2014)Locally Reinforced Polymer-Based Composites for Elastic Electronics, , , , , , , and . ACS Applied Materials & Interfaces, 4 (6): 2860--2864 (June 2012)Impact of Mechanical Bending on ZnO and IGZO Thin-Film Transistors, , and . IEEE Electron Device Letters, (November 2010)The Effects of Mechanical Bending and Illumination on the Performance of Flexible IGZO TFTs, , and . IEEE Transactions on Electron Devices, 58 (7): 2041--2048 (July 2011)