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Adaptive Transient Leakage-Aware Linearised Model for Thermal Analysis of 3-D ICs.

, , and . DATE, page 268-271. IEEE, (2019)

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Thermal Modeling and Design Exploration for Monolithic 3D ICs., , , and . ISQED, page 1-6. IEEE, (2022)Physical Design Issues in 3-D Integrated Technologies., and . VLSI-SoC (Selected Papers), volume 313 of IFIP Advances in Information and Communication Technology, page 1-21. Springer, (2008)Adaptive Word Reordering for Low-Power Inter-Chip Communication., , and . DATE, page 980-983. IEEE, (2019)Metal Stack and Partitioning Exploration for Monolithic 3D ICs., , and . ISVLSI, page 398-403. IEEE, (2020)Via placement for minimum interconnect delay in three-dimensional (3D) circuits., and . ISCAS, IEEE, (2006)IC thermal analyzer for versatile 3-D structures using multigrid preconditioned krylov methods., , , and . ICCAD, page 123. ACM, (2016)A software-supported methodology for designing high-performance 3D FPGA architectures., , , and . VLSI-SoC, page 54-59. IEEE, (2007)Contactless inter-tier communication for heterogeneous 3-D ICs., and . ISCAS, page 1-4. IEEE, (2017)Efficient teaching of digital design with automated assessment and feedback., , and . EWME, page 203-207. IEEE, (2014)Power distribution paths in 3-D ICS., and . ACM Great Lakes Symposium on VLSI, page 263-268. ACM, (2009)