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Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC.

J. Lin, W. Chang, H. Hsieh, Y. Shyu, Y. Chang, and J. Lu. IEEE Trans. Very Large Scale Integr. Syst., 29 (9): 1652-1664 (2021)

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Ming-Kuei Lu

Lu Lu

Helmar Minger

Jorge Mínguez

Karl Minga

Other publications of authors with the same name

Design space exploration with a cycle-accurate systemC/TLM DRAM controller model.T. Hsu, C. Wu, C. Hsu, C. Huang, J. Liou, Y. Chen, and J. Lu. VLSI-DAT, page 1-4. IEEE, (2017)Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC.J. Lin, W. Chang, H. Hsieh, Y. Shyu, Y. Chang, and J. Lu. IEEE Trans. Very Large Scale Integr. Syst., 29 (9): 1652-1664 (2021)Tile-Based Architecture Exploration for Convolutional Accelerators in Deep Neural Networks.Y. Chen, Y. Yen, C. Chen, T. Chen, C. Huang, J. Liou, and J. Lu. AICAS, page 1-4. IEEE, (2021)A 90nm 103.14 TOPS/W Binary-Weight Spiking Neural Network CMOS ASIC for Real-Time Object Classification.P. Chuang, P. Tan, C. Wu, and J. Lu. DAC, page 1-6. IEEE, (2020)Optimization of AI SoC with Compiler-assisted Virtual Design Platform.C. Huang, J. Lu, Y. Chen, M. Tung, and S. Chang. ISPD, page 187-193. ACM, (2023)Content-aware line-based power modeling methodology for image signal processor.C. Chen, M. Shieh, J. Lu, H. Huang, and Y. Chen. SoCC, page 346-350. IEEE, (2017)Full System Emulation of Embedded Heterogeneous Multicores Based on QEMU.I. Chen, C. King, Y. Chen, and J. Lu. ICPADS, page 771-778. IEEE, (2018)Fault Modeling and Testing of Memristor-Based Spiking Neural Networks.K. Hou, H. Cheng, C. Tung, C. Wu, and J. Lu. ITC, page 92-99. IEEE, (2022)Fast Steady-State Thermal Analysis.L. Chiou, C. Chang, L. Lu, W. Yang, Y. Chang, and J. Lu. ISOCC, page 15-16. IEEE, (2018)Application specific component-service-aware trace generation on Android-QEMU.H. Wei, C. King, B. Das, M. Peng, C. Wang, H. Huang, and J. Lu. SoCC, page 316-321. IEEE, (2017)

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Disambiguation of "Lu, Juin-Ming"

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Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC.

Please choose a person to relate this publication to

Ming-Kuei Lu

Lu Lu

Helmar Minger

Jorge Mínguez

Karl Minga

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lu, Juin-Ming"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC.

Please choose a person to relate this publication to

Ming-Kuei Lu

Lu Lu

Helmar Minger

Jorge Mínguez

Karl Minga

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC.