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High-throughput photonic packaging., , , , , , , , , and 6 other author(s). OFC, page 1-3. IEEE, (2017)A silicon metamaterial chip-to-chip coupler for photonic flip-chip applications., , , , and . OFC, page 1-3. IEEE, (2017)Silicon Photonic Gas Sensing., , , , , , , , , and 7 other author(s). OFC, page 1-3. IEEE, (2019)Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability., , , , , , , , , and 6 other author(s). OFC, page 1-3. IEEE, (2015)Monolithic silicon photonics at 25 Gb/s., , , , , , , , , and 13 other author(s). OFC, page 1-3. IEEE, (2016)Monolithic Silicon Photonic WDM Transceivers., , , , , , , , , and 11 other author(s). ECOC, page 1-3. IEEE, (2017)Kjing: (mix the knowledge)., and . WWW (Companion Volume), page 377-380. ACM, (2012)TAnaTo2: A Tool to Evaluate the Impact of Natural and Anthropogenic Artefacts with a TIN-Based Model., and . OGRS, page 63-85. Springer, (2009)A Proprioceptive Method for Soft Robots Using Inertial Measurement Units., , and . IROS, page 9379-9384. IEEE, (2022)