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Hot Chips 28., and . IEEE Micro, 37 (2): 5-6 (2017)Transforming nanodevices into nanosystems: The N3XT 1, 000X.. LATS, page 6. IEEE, (2016)The resilience wall: Cross-layer solution strategies., , , , , , , , , and 3 other author(s). VLSI-DAT, page 1-11. IEEE, (2014)A Design Diversity Metric and Analysis of Redundant Systems., , and . IEEE Trans. Computers, 51 (5): 498-510 (2002)The N3XT Approach to Energy-Efficient Abundant-Data Computing., , , , , , , , , and 1 other author(s). Proc. IEEE, 107 (1): 19-48 (2019)Robust System Design., , , , , , , , , and 4 other author(s). IPSJ Trans. Syst. LSI Des. Methodol., (2011)Recent Advances and New Avenues in Hardware-Level Reliability Support., , , and . IEEE Micro, 25 (6): 18-29 (2005)Three-Dimensional Stacked Neural Network Accelerator Architectures for AR/VR Applications., , , , , , , , and . IEEE Micro, 42 (6): 116-124 (2022)Carbon nanotube computer: transforming scientific discoveries into working systems.. ISPD, page 117-118. ACM, (2014)Optimized reseeding by seed ordering and encoding., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 24 (2): 264-270 (2005)