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Fast physics-based electromigration analysis for multi-branch interconnect trees.

, , , , , and . ICCAD, page 169-176. IEEE, (2017)

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Compact nonlinear thermal modeling of packaged integrated systems., , , , and . ASP-DAC, page 157-162. IEEE, (2013)GPU-accelerated parallel Monte Carlo analysis of analog circuits by hierarchical graph-based solver., and . ASP-DAC, page 719-724. IEEE, (2015)EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks., , , , and . IEEE Trans. Very Large Scale Integr. Syst., 27 (4): 940-953 (2019)Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (12): 3137-3150 (2018)A Fast Leakage-Aware Full-Chip Transient Thermal Estimation Method., , , , , , , and . IEEE Trans. Computers, 67 (5): 617-630 (2018)Data-Driven Electrostatics Analysis based on Physics-Constrained Deep learning., , and . DATE, page 1382-1387. IEEE, (2021)Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation., , , , and . ISQED, page 386-391. IEEE, (2014)Partial random walk for large linear network analysis., , , and . ISCAS (5), page 173-177. IEEE, (2004)Thermal modeling for energy-efficient smart building with advanced overfitting mitigation technique., , , , , , , , and . ASP-DAC, page 417-422. IEEE, (2016)A systematic method for functional unit power estimation in microprocessors., , , , and . DAC, page 554-557. ACM, (2006)