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Enhanced thermal characterization method of microscale heatsink structures.

, , and . Microelectron. Reliab., (2016)

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Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s)., , and . Microelectron. J., 46 (12): 1202-1207 (2015)An Efficient and Simple Method for Modelling Solar Cells., , and . Period. Polytech. Electr. Eng. Comput. Sci., (2020)Contactless Thermal Characterization of High Temperature Test Chamber, , , and . CoRR, (2008)Enhanced thermal characterization method of microscale heatsink structures., , and . Microelectron. Reliab., (2016)Integrated Thermal Management in System-on-Package Devices., , , , , and . Period. Polytech. Electr. Eng. Comput. Sci., 64 (2): 200-210 (2020)Die Attach Quality Testing by Fully Contact-less Measurement Method., , , and . DDECS, page 81-82. IEEE Computer Society, (2006)Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array, , and . CoRR, (2007)Comprehensive Design of a High Frequency PLL Synthesizer for ZigBee Application., , and . DDECS, page 39-43. IEEE Computer Society, (2006)Generalization of the thermal model of infrared radiation sensors., , and . Microelectron. J., 46 (6): 543-550 (2015)Contactless characterization of MEMS devices using optical microscopy., and . DDECS, page 210-213. IEEE Computer Society, (2009)