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Disambiguation of "Dong, Gang"

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The Quantum Shor Algorithm Simulated on FPGA.

, , , , , , and . ISPA/BDCloud/SocialCom/SustainCom, page 542-546. IEEE, (2019)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Michael Döngi

Purinerge und GAbAerge Calciumsignale in Astrozyten des Bulbus olfactorius der Maus. TU Kaiserslautern, (2009)

Eugen Gäng

Willy Gäng

Jochen Gäng

Gang Zhao

 

Other publications of authors with the same name

Credit scorecard based on logistic regression with random coefficients., , and . ICCS, volume 1 of Procedia Computer Science, page 2463-2468. Elsevier, (2010)Path Optimization of Coal Mining Machine Based on Virtual Coal-Rock Interface., , and . 3PGCIC, volume 1 of Lecture Notes on Data Engineering and Communications Technologies, page 517-523. Springer, (2016)Optimal design of a parallel assembling robot with large payload-to-mass ratio., , , , , , and . Robotics Comput. Integr. Manuf., (2023)Motion Flow Estimation from Image Sequences with Applications to Biological Growth and Motility., , and . ICIP, page 1245-1248. IEEE, (2006)Despeckling trilateral filter., , and . IVMSP, page 42-47. IEEE, (2011)Universal closed-form expression based on magnetic flux density for the inductance of Tapered Through-Silicon Vias (T-TSVs)., , , , , and . Microelectron. J., (2017)Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method., , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 31 (11): 1653-1664 (November 2023)FY-3E Wind Scatterometer Prelaunch and Commissioning Performance Verification., , , , , , , , , and 3 other author(s). IEEE Trans. Geosci. Remote. Sens., (2023)Group-wise co-salient object detection via multi-view self-labeling novel class discovery., , , , and . Frontiers Comput. Sci., 18 (2): 182709 (April 2024)New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs)., , , , , and . IEICE Electron. Express, 13 (8): 20160192 (2016)