( en | de | ru )

 

Disambiguation of "Lall, Pradeep"

Author of the publication

copydeleteadd this publication to your clipboard
Prognostication of LED remaining useful life and color stability in the presence of contamination.

, , and . ICPHM, page 1-8. IEEE, (2015)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Pradeep Pareek

Eleanor Lallis

Lügen und Belogenwerden: pädagogische Untersuchung zur wissentlichen Täuschung. Uni Wuppertal, (2008)

Pradeep Itty

Deepti Lall

Pradeep Punnakal

 

Other publications of authors with the same name

Feature extraction and damage-precursors for prognostication of lead-free electronics., , , , , and . Microelectron. Reliab., 47 (12): 1907-1920 (2007)Cell Lifetime Degradation Model Development for Li-Ion Coin Cells considering Calendar Aging and Post-Knee Degradation (Invited)., and . IRPS, page 5. IEEE, (2024)Prognostication of remaining useful-life for flexible batteries in foldable wearable electronics., and . ICPHM, page 1-10. IEEE, (2016)Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging., , and . Microelectron. Reliab., (2016)Prognostics health management of electronic systems - A reliability physics approach., , and . IRPS, page 6. IEEE, (2018)Estimation of SOH Degradation of Coin Cells Subjected to Accelerated Life Cycling with Randomized Cycling Depths and C-Rates., , , and . IRPS, page 1-10. IEEE, (2023)Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads., , , , and . Microelectron. Reliab., 49 (8): 825-838 (2009)Prognostication of solder-joint reliability of 0.4mm and 0.5mm pitch bgas subjected to mechanical shocks up to 10, 000G., , , , and . ICPHM, page 1-14. IEEE, (2015)ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments., , and . ICPHM, page 1-10. IEEE, (2016)PHM of state-of-charge for flexible power sources in wearable electronics with EKF., , and . IRPS, page 2-1. IEEE, (2018)