Author of the publication

Leakage in nano-scale technologies: mechanisms, impact and design considerations.

, , , and . DAC, page 6-11. ACM, (2004)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

A multi-story power delivery technique for 3D integrated circuits., , , and . ISLPED, page 57-62. ACM, (2008)A 2.1 pJ/bit, 8 Gb/s Ultra-Low Power In-Package Serial Link Featuring a Time-based Front-end and a Digital Equalizer., , , and . A-SSCC, page 187-190. IEEE, (2018)A multi-phase VCO quantizer based adaptive digital LDO in 65nm CMOS technology., and . ISCAS, page 1-4. IEEE, (2017)A 0.4-1.6GHz spur-free bang-bang digital PLL in 65nm with a D-flip-flop based frequency subtractor circuit., , and . VLSIC, page 140-. IEEE, (2015)19.2 A 0.2-to-1.45GHz subsampling fractional-N all-digital MDLL with zero-offset aperture PD-based spur cancellation and in-situ timing mismatch detection., , and . ISSCC, page 326-327. IEEE, (2016)A fully integrated 40pF output capacitor beat-frequency-quantizer-based digital LDO with built-in adaptive sampling and active voltage positioning., , , , and . ISSCC, page 308-310. IEEE, (2018)A logic-compatible embedded flash memory featuring a multi-story high voltage switch and a selective refresh scheme., , and . VLSIC, page 130-131. IEEE, (2012)Fault-tolerant ripple-carry binary adder using partial triple modular redundancy (PTMR)., , and . ISCAS, page 41-44. IEEE, (2015)Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited)., , , and . IRPS, page 8. IEEE, (2022)Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters., , , , and . IRPS, page 1-5. IEEE, (2023)