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Study of the self-alignment of no-flow underfill for micro-BGA assembly.

, , and . Microelectron. Reliab., 41 (11): 1867-1875 (2001)

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Study of micro-BGA solder joint reliability., , , and . Microelectron. Reliab., 41 (2): 287-293 (2001)Reliability of microBGA assembly using no-flow underfill., , and . Microelectron. Reliab., 41 (12): 1993-2000 (2001)Study of the self-alignment of no-flow underfill for micro-BGA assembly., , and . Microelectron. Reliab., 41 (11): 1867-1875 (2001)