( en | de | ru )

 

Disambiguation of "Lim, Hyunyul"

Author of the publication

copydeleteadd this publication to your clipboard
Dynamic thermal management for 3D multicore processors under process variations.

, , , and . IEICE Electron. Express, 10 (23): 20130800 (2013)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Hans Lim

Frans Lim

Soyoung Lim

Minha Lim

Rastoni Lim

 

Other publications of authors with the same name

3-D Stacked DRAM Refresh Management With Guaranteed Data Reliability., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 34 (9): 1455-1466 (2015)Low power scan bypass technique with test data reduction., , , , and . ISQED, page 173-176. IEEE, (2015)A Hardware-efficient TSV Repair Scheme Based on Butterfly Topology., , , and . ISOCC, page 63-64. IEEE, (2019)Thermal-aware dynamic voltage frequency scaling for many-core processors under process variations., , , and . IEICE Electron. Express, 10 (14): 20130463 (2013)Neural Network Reliability Enhancement Approach Using Dropout Underutilization in GPU., , , and . TENCON, page 2281-2286. IEEE, (2018)LARECD: Low area overhead and reliable error correction DMR architecture., , , and . ISOCC, page 27-28. IEEE, (2017)Dynamic thermal management for 3D multicore processors under process variations., , , and . IEICE Electron. Express, 10 (23): 20130800 (2013)A 3 Dimensional Built-In Self-Repair Scheme for Yield Improvement of 3 Dimensional Memories., , , and . IEEE Trans. Reliab., 64 (2): 586-595 (2015)Optimized Built-In Self-Repair for Multiple Memories., , , and . IEEE Trans. Very Large Scale Integr. Syst., 24 (6): 2174-2183 (2016)Scan-Chain-Fault Diagnosis Using Regressions in Cryptographic Chips for Wireless Sensor Networks., , and . Sensors, 20 (17): 4771 (2020)