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On the impact of 3D integration on high-throughput sensor information processing: A case study with image sensing.

, , and . NANOARCH, page 128-133. IEEE Computer Society, (2013)

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On the parametric failures of SRAM in a 3D-die stack considering tier-to-tier supply cross-talk., , , and . VTS, page 264-269. IEEE Computer Society, (2012)Self-calibration technique for reduction of hold failures in low-power nano-scaled SRAM., , , and . DAC, page 971-976. ACM, (2006)On the potential of 3D integration of inductive DC-DC converter for high-performance power delivery., , and . DAC, page 179:1-179:8. ACM, (2013)Exploring tunnel-FET for ultra low power analog applications: a case study on operational transconductance amplifier., , and . DAC, page 109:1-109:6. ACM, (2013)On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking., and . DAC, page 27:1-27:6. ACM, (2014)MagNet: Discovering Multi-agent Interaction Dynamics using Neural Network., , , , and . ICRA, page 8158-8164. IEEE, (2020)Reduction of Parametric Failures in Sub-100-nm SRAM Array Using Body Bias., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 27 (1): 174-183 (2008)An Unsupervised Anomalous Event Detection Framework with Class Aware Source Separation., , and . ICASSP, page 2671-2675. IEEE, (2018)Design and Analysis of a Neural Network Inference Engine Based on Adaptive Weight Compression., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 38 (1): 109-121 (2019)A 128b AES Engine with Higher Resistance to Power and Electromagnetic Side-Channel Attacks Enabled by a Security-Aware Integrated All-Digital Low-Dropout Regulator., , , , , and . ISSCC, page 404-406. IEEE, (2019)