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The defect-centric perspective of device and circuit reliability - From individual defects to circuits., , , , , , , , , и 5 other автор(ы). ESSDERC, стр. 218-225. IEEE, (2015)Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node., , , , , , , , , и 7 other автор(ы). VLSI Technology and Circuits, стр. 429-430. IEEE, (2022)Reliability and Variability-Aware DTCO Flow: Demonstration of Projections to N3 FinFET and Nanosheet Technologies., , , , , , , , , и 10 other автор(ы). IRPS, стр. 1-6. IEEE, (2021)Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)., , , , , , , , , и 6 other автор(ы). IRPS, стр. 1-7. IEEE, (2023)On reliability enhancement using adaptive core voltage scaling and variations on nanoscale FPGAs., , , и . LATW, стр. 1-4. IEEE, (2014)Design of a 150 mV Supply, 2 MIPS, 90nm CMOS, Ultra-Low-Power Microprocessor., , , и . PATMOS, том 7606 из Lecture Notes in Computer Science, стр. 175-184. Springer, (2012)Methodology for Application-Dependent Degradation Analysis of Memory Timing., , , , , , и . DATE, стр. 162-167. IEEE, (2019)Comphy - A compact-physics framework for unified modeling of BTI., , , , , , , , , и 4 other автор(ы). Microelectron. Reliab., (2018)Understanding the Impact of Time-Dependent Random Variability on Analog ICs: From Single Transistor Measurements to Circuit Simulations., , , , , и . IEEE Trans. Very Large Scale Integr. Syst., 27 (3): 601-610 (2019)Comparison of NBTI aging on adder architectures and ring oscillators in the downscaling technology nodes., , , , , , , , , и 5 other автор(ы). Microprocess. Microsystems, 39 (8): 1039-1051 (2015)