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112 Gb/s PDM-PAM4 Generation and 80 km Transmission Using a Novel Monolithically Integrated Dual-Polarization Electro-Absorption Modulator InP PIC.

, , , , , , , , , , , and . ECOC, page 1-3. IEEE, (2017)

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Performance Evaluation of InP-Based DP-IQ Modulators for Multiband Transmission Systems., , , , , , , and . ICTON, page 1-4. IEEE, (2020)Coherent receiver photonic integrated circuits., , , , , , and . OFC/NFOEC, page 1-3. IEEE, (2013)56 GBaud PAM-4 Direct Detection with High-Speed Avalanche Photodiodes., , , , , , and . OFC, page 1-3. IEEE, (2023)4 x 200 Gb/s EML-Array with a Single MQW Layer Stack., , , , , , , , and . OFC, page 1-4. IEEE, (2023)Novel integration technologies for disruptive capacity upgrade in data center systems., , , , , , , , , and 1 other author(s). OFC, page 1-3. IEEE, (2016)Inverse-Designed InP-Based Polarization Rotator-Splitter., , , , , and . OFC, page 1-3. IEEE, (2021)Hybrid Polymer Integration for Communications, Sensing and Quantum Technologies from the Visible to the Infrared., , , , , , , , , and 2 other author(s). ECOC, page 1-4. IEEE, (2021)Impedance-engineered low power MZM / driver assembly for CFP4-size pluggable long haul and metro transceiver., , , , , , , , , and . ECOC, page 1-3. IEEE, (2014)High Isolation Optical Isolator: A new Building Block for PolyBoard Photonic Integrated Circuits., , , , , , , and . ECOC, page 1-3. IEEE, (2018)Low-Loss Vertical MMI Coupler for 3D Photonic Integration., , , , , , , and . ECOC, page 1-3. IEEE, (2018)