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A 200 MHz 14 W Pulsed Optical Illuminator With Laser Driver ASIC and On-Chip DLL-Based Time Interpolator for Indirect Time-of-Flight Applications., , , , , , , and . IEEE Trans. Circuits Syst. II Express Briefs, 70 (2): 396-400 (February 2023)A 2KSPS 123dB Dynamic-Range SPAD-based Optical Sensor SoC with On-chip Auto-Gain-Control and FFT Processor for 100 μlux Light Illuminance and Flicker Detection., , , , , , , , , and 2 other author(s). ISCAS, page 1-5. IEEE, (2023)dToF LIDAR System Using Addressable Multi-Channel VCSEL Transmitter, 128x80 SPAD Sensor, and ML-Based Object Detection for Adaptive Beam-Steering., , , , , , , , , and 9 other author(s). CICC, page 1-2. IEEE, (2023)Multi-Scale Histogram-Based Probabilistic Deep Neural Network for Super-Resolution 3D LiDAR Imaging., , and . Sensors, 23 (1): 420 (2023)An 8-A Sub-1ns Pulsed VCSEL Driver IC With Built-In Pulse Monitor and Automatic Peak Current Control for Direct Time-of-Flight Applications., , , , , , , , , and 5 other author(s). IEEE Trans. Circuits Syst. II Express Briefs, 69 (11): 4193-4197 (2022)A 40nm 2TOPS/W Depth-Completion Neural Network Accelerator SoC With Efficient Depth Engine for Realtime LiDAR Systems., , , , , , , , , and 3 other author(s). IEEE Trans. Circuits Syst. II Express Briefs, 70 (5): 1704-1708 (May 2023)An Angle-Insensitive Time-Interleaved 4-Channels 138dB Dynamic Range Light Sensor with Flicker Detection for Smart Lighting Application., , , , , , , , and . ISCAS, page 1-5. IEEE, (2023)A Fully Integrated dToF System-on-Chip with High Precision Using Adaptive Optical Power Control and Shifted Histogram-Bin Binning., , , , , , , and . ISCAS, page 1-5. IEEE, (2023)An integrated 8A pulsed VCSEL array driver under 12V supply with built-in pulse monitor and automatic peak current control for direct time-of-flight applications., , , , , , , , , and . A-SSCC, page 1-3. IEEE, (2021)Solid-State dToF LiDAR System Using an Eight-Channel Addressable, 20-W/Ch Transmitter, and a 128 × 128 SPAD Receiver With SNR-Based Pixel Binning and Resolution Upscaling., , , , , , , , , and 5 other author(s). IEEE J. Solid State Circuits, 58 (3): 757-770 (March 2023)