Author of the publication

A 250-MHz single-chip multiprocessor for audio and video signal processing.

, , , , and . IEEE J. Solid State Circuits, 36 (11): 1768-1774 (2001)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

A 250-MHz single-chip multiprocessor for audio and video signal processing., , , , and . IEEE J. Solid State Circuits, 36 (11): 1768-1774 (2001)Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration., , , , , , , , , and . Micromachines, 2 (1): 49-68 (2011)Microarchitecture and implementation of the synergistic processor in 65-nm and 90-nm SOI., , , , , , , , , and 19 other author(s). IBM J. Res. Dev., 51 (5): 529-544 (2007)Cell Broadband Engine Architecture and its first implementation - A performance view., , , and . IBM J. Res. Dev., 51 (5): 559-572 (2007)Playful Engagement for Public Spaces: A Case Study on a Mall Escalator., , , and . Proc. ACM Hum. Comput. Interact., 5 (ISS): 498:1-498:19 (2021)Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch., , , and . 3DIC, page 1-4. IEEE, (2009)The microarchitecture of the synergistic processor for a cell processor., , , , , , , , , and 11 other author(s). IEEE J. Solid State Circuits, 41 (1): 63-70 (2006)Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature., , , , , , and . 3DIC, page 1-5. IEEE, (2010)