( en | de | ru )

 

Disambiguation of "Sato, Tomoya"

Author of the publication

copydeleteadd this publication to your clipboard
Robust Localization Approach Using Hybrid Correspondence NDT and Real-Time Uncertainty Estimation.

, , , , and . SII, page 1099-1106. IEEE, (2024)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Makoto Sato

Tomoya Wada

Nobuko Sato

Fujio Sato

Satô Saburô

 

Other publications of authors with the same name

Trajectory planning and control for biped robot with toe and heel joints., , and . AMC, page 129-136. IEEE, (2010)Error Covariance Estimation of 3D Point Cloud Registration Considering Surrounding Environment., , , , and . J. Robotics Mechatronics, 35 (2): 435-444 (April 2023)Robust Localization Approach Using Hybrid Correspondence NDT and Real-Time Uncertainty Estimation., , , , and . SII, page 1099-1106. IEEE, (2024)A method for real-time rendering of water droplets taking into account interactive depth of field effects., , and . IWEC, volume 240 of IFIP Conference Proceedings, page 125-132. Kluwer, (2002)IDSET: Interactive Design System using Evolutionary Techniques., and . Comput. Aided Des., 33 (5): 367-377 (2001)Validation of a Nondestructive Measurement System for Evaluating Surface Charge Distribution of Nonwoven Electret Fabrics., , , , , and . IEEE Access, (2024)Vision-based Localization using a Monocular Camera in the Rain., , , and . ITSC, page 293-298. IEEE, (2019)Biped walking pattern generation by using preview control with virtual plane method., , and . AMC, page 414-419. IEEE, (2010)Organic Thin Film-Assisted Copper Electroless Plating on Flat/Microstructured Silicone Substrates., , , , , and . IEICE Trans. Electron., 102-C (2): 147-150 (2019)Multi-DOF Micro-Macro Bilateral Controller Using Oblique Coordinate Control., , and . IEEE Trans. Ind. Informatics, 7 (3): 446-454 (2011)