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Disambiguation of "Kim, Joungho"

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Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.

, , , , , , and . EMC Compo, page 248-251. IEEE, (2015)

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Ky ng Kim

Die Artikelstruktur in passiven zweisprachigen Wörterbüchern Deutsch-Koreanisch: Konzeption zur Erstellung eines zweisprachigen Lernerwörterbuchs Deutsch-Koreanisch. Uni Heidelberg, (2008)

Youngsang Kim

Sunghun Kim

Yongkyu Kim

Taekwan Kim

 

Other publications of authors with the same name

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC., , , , , , and . EMC Compo, page 212-215. IEEE, (2015)Signal integrity modeling and measurement of TSV in 3D IC., and . ASP-DAC, page 13-16. IEEE, (2013)Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material., , , , , , , , and . IEEE Trans. Ind. Electron., 66 (5): 4054-4064 (2019)Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network., , , , , and . IEICE Trans. Electron., 91-C (4): 595-606 (2008)Fault detection and isolation of multiple defects in through silicon via (TSV) channel., , , , , , and . 3DIC, page 1-5. IEEE, (2014)Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC., , , , and . 3DIC, page 1-5. IEEE, (2016)Active Si interposer for 3D IC integrations.. 3DIC, page TS11.1.1-TS11.1.3. IEEE, (2015)Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC., , , , , , and . EMC Compo, page 248-251. IEEE, (2015)Learning Collaborative Policies to Solve NP-hard Routing Problems., , and . NeurIPS, page 10418-10430. (2021)Chip-package hybrid clock distribution network and DLL for low jitter clock delivery., , , , , , , , and . IEEE J. Solid State Circuits, 41 (1): 274-286 (2006)