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A 500 MHz-BW -52.5 dB-THD Voltage-to-Time Converter Utilizing Two-Step Transition Inverter Delay Lines in 28 nm CMOS., , , , and . IEICE Trans. Electron., 100-C (6): 560-567 (2017)Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card., , , , , , and . IEEE J. Solid State Circuits, 47 (10): 2484-2495 (2012)A 12-Gb/s Non-Contact Interface With Coupled Transmission Lines., , , , , and . IEEE J. Solid State Circuits, 48 (3): 790-800 (2013)Design Methodology and Validity Verification for a Reactive Countermeasure Against EM Attacks., , , , , and . J. Cryptol., 30 (2): 373-391 (2017)Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices., , , , , , , , and . IEEE J. Solid State Circuits, 55 (10): 2747-2755 (2020)A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package., , , , and . IEEE J. Solid State Circuits, 41 (1): 23-34 (2006)A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface., , , , , , , , , and 1 other author(s). IEEE Micro, 33 (6): 6-15 (2013)An 11Gb/s Inductive-Coupling Link with Burst Transmission., , , , , and . ISSCC, page 298-299. IEEE, (2008)6W/25mm2 inductive power transfer for non-contact wafer-level testing., , , , , , and . ISSCC, page 230-232. IEEE, (2011)A 12Gb/s non-contact interface with coupled transmission lines., , , , , and . ISSCC, page 492-494. IEEE, (2011)