author- IEEE T. Instrumentation and Measurement 61(2):456-461 (2012)
- IEEE T. Instrumentation and Measurement 61(3):842-844 (2012)
- Microelectronics Reliability 49(9-11):1256-1259 (2009)
- Different Failure signatures of multiple TLP and HBM Stresses in an ESD robust protection structure.Microelectronics Reliability 45(9-11):1415-1420 (2005)
- Microelectronics Reliability 47(9-11):1818-1822 (2007)
- Microelectronics Reliability 43(9-11):1551-1556 (2003)
- Microelectronics Reliability 48(8-9):1237-1240 (2008)
- Intelligent Networking, Collaborative Systems and Applications, volume 329 of Studies in Computational Intelligence, (2011)
- ICCA, page 1037-1043. IEEE, (2011)
- JFSMA, page 45-48. Lavoisier, (2006)
- JFSMA, page 253-266. Lavoisier, (2006)
- JFSMA, page 163-166. Lavoisier, (2006)
- JFSMA, page 63-76. Lavoisier, (2006)
- JFSMA, page 23-26. Lavoisier, (2006)
- PAAMS, volume 88 of Advances in Intelligent and Soft Computing, page 129-134. Springer, (2011)
- ICSIPA, page 421-426. IEEE, (2011)
- ICSIPA, page 121-126. IEEE, (2011)
- IEEE Communications Letters 9(1):61-63 (2005)
- ENTER, page 559-571. Springer Vienna, (2011)
- (2011)
