Inproceedings,
Interconnect design and analysis for Through Silicon Interposers (TSIs).
J. Cubillo, R. Weerasekera, Z. Oo, E. Liu, B. Conn, S. Bhattacharya, and R. Patti.3DIC, page 1-6. IEEE, (2011)
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- conf/3dic/CubilloWOLCBP11
- entry type
- inproceedings
- booktitle
- 3DIC
- year
- 2011
- pages
- 1-6
- publisher
- IEEE
- crossref
- conf/3dic/2011
- ee
- https://doi.org/10.1109/3DIC.2012.6263039
- isbn
- 978-1-4673-2189-1
- url
- http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#CubilloWOLCBP11
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- please select -%0 Conference Paper
%1 conf/3dic/CubilloWOLCBP11
%A Cubillo, Joseph Romen
%A Weerasekera, Roshan
%A Oo, Zaw Zaw
%A Liu, En-Xiao
%A Conn, Bob
%A Bhattacharya, Surya
%A Patti, Robert
%B 3DIC
%D 2011
%E Koyanagi, Mitsumasa
%E Kada, Morihiro
%I IEEE
%K dblp
%P 1-6
%T Interconnect design and analysis for Through Silicon Interposers (TSIs).
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#CubilloWOLCBP11
%@ 978-1-4673-2189-1
@inproceedings{conf/3dic/CubilloWOLCBP11,
added-at = {2023-09-30T00:00:00.000+0200},
author = {Cubillo, Joseph Romen and Weerasekera, Roshan and Oo, Zaw Zaw and Liu, En-Xiao and Conn, Bob and Bhattacharya, Surya and Patti, Robert},
biburl = {https://www.bibsonomy.org/bibtex/2efbbb8da39d5ce888933c7d704c9284d/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2011},
editor = {Koyanagi, Mitsumasa and Kada, Morihiro},
ee = {https://doi.org/10.1109/3DIC.2012.6263039},
interhash = {06fbd5996b1e448a617157b78b3bee66},
intrahash = {efbbb8da39d5ce888933c7d704c9284d},
isbn = {978-1-4673-2189-1},
keywords = {dblp},
pages = {1-6},
publisher = {IEEE},
timestamp = {2024-04-10T12:11:22.000+0200},
title = {Interconnect design and analysis for Through Silicon Interposers (TSIs).},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#CubilloWOLCBP11},
year = 2011
}