Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Crosstalk immune interconnect driver design., , , and . SoC, page 139-142. IEEE, (2004)On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits., , , and . DATE, page 1325-1328. IEEE Computer Society, (2010)Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI)., , , , , , , , , and . IEEE Des. Test, 32 (4): 23-31 (2015)Early selection of system implementation choice among SoC, SoP and 3-D Integration., , , and . SoCC, page 187-190. IEEE, (2007)Optimal network architectures for minimizing average distance in k-ary n-dimensional mesh networks., , , , and . NOCS, page 57-64. ACM/IEEE Computer Society, (2011)3-D integration and the limits of silicon computation., , , and . VLSI-SoC, page 343-348. IEEE, (2011)Interconnect design and analysis for Through Silicon Interposers (TSIs)., , , , , , and . 3DIC, page 1-6. IEEE, (2011)Design exploration of 3D stacked non-volatile memory by conductive bridge based crossbar., , , , and . 3DIC, page 1-6. IEEE, (2011)High-speed and low-power 2.5D I/O circuits for memory-logic-integration by through-silicon interposer., , , , , and . 3DIC, page 1-4. IEEE, (2013)Delay-Balanced Smart Repeaters for On-Chip Global Signaling., , , and . VLSI Design, page 308-313. IEEE Computer Society, (2007)