%0 Journal Article %1 journals/mr/TanCCLS04 %A Tan, C. W. %A Chan, Y. C. %A Chan, H. P. %A Leung, N. W. %A So, C. K. %D 2004 %J Microelectron. Reliab. %K dblp %N 5 %P 823-831 %T Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. %U http://dblp.uni-trier.de/db/journals/mr/mr44.html#TanCCLS04 %V 44

@article{journals/mr/TanCCLS04, added-at = {2020-02-22T00:00:00.000+0100}, author = {Tan, C. W. and Chan, Y. C. and Chan, H. P. and Leung, N. W. and So, C. K.}, biburl = {https://www.bibsonomy.org/bibtex/2868403dfcbeebb7b7fcc90f1edac4078/dblp}, ee = {https://doi.org/10.1016/j.microrel.2003.10.003}, interhash = {028da610d24fb70184e9bd9f01d8b4b7}, intrahash = {868403dfcbeebb7b7fcc90f1edac4078}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 5, pages = {823-831}, timestamp = {2020-02-25T13:25:51.000+0100}, title = {Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr44.html#TanCCLS04}, volume = 44, year = 2004 }