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Disambiguation of "Chan, H. P."

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Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging.

, , , , and . Microelectron. Reliab., 44 (5): 823-831 (2004)

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H -P Schütt

P H Schmitt

Ruediger P H Adolf

Johannes H P Schulz

Maarten H P Kole

 

Other publications of authors with the same name

Silicon oxynitride integrated waveguide for on-chip optical interconnects applications., , , , and . Microelectron. Reliab., 48 (2): 212-218 (2008)Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging., , , , and . Microelectron. Reliab., 44 (5): 823-831 (2004)An Efficient Disk-Array-Based Server Design for a Multicast Video Streaming System., and . ASAP, page 271-281. IEEE Computer Society, (2003)Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film., , , and . Microelectron. Reliab., 44 (3): 505-514 (2004)An efficient disk-array-based server design for a multicast video streaming system., and . Int. J. Embed. Syst., 3 (4): 263-270 (2008)Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride., , , , and . Microelectron. Reliab., 46 (12): 2056-2061 (2006)Depicting Diversity in Rules Extracted from Ensembles., , , and . ISNN (4), volume 56 of Advances in Intelligent and Soft Computing, page 391-400. Springer, (2009)A novel approach for fabricating light-emitting porous polysilicon films., , , and . Microelectron. Reliab., 42 (6): 929-933 (2002)Classification of Astrophysics Journal Articles with Machine Learning to Identify Data for NED, , , , , , , , , and . (2022)cite arxiv:2201.03636Comment: 11 pages, 3 figures, 6 tables.