%0 Journal Article %1 journals/tcad/NakatakeFMK98 %A Nakatake, Shigetoshi %A Fujiyoshi, Kunihiro %A Murata, Hiroshi %A Kajitani, Yoji %D 1998 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 6 %P 519-530 %T Module packing based on the BSG-structure and IC layout applications. %U http://dblp.uni-trier.de/db/journals/tcad/tcad17.html#NakatakeFMK98 %V 17

@article{journals/tcad/NakatakeFMK98, added-at = {2020-09-24T00:00:00.000+0200}, author = {Nakatake, Shigetoshi and Fujiyoshi, Kunihiro and Murata, Hiroshi and Kajitani, Yoji}, biburl = {https://www.bibsonomy.org/bibtex/2b4f58f5fd0c4ba01cad27557c00bbd45/dblp}, ee = {https://doi.org/10.1109/43.703832}, interhash = {1063f1417615852a2bb4f2bd27a74156}, intrahash = {b4f58f5fd0c4ba01cad27557c00bbd45}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, number = 6, pages = {519-530}, timestamp = {2020-09-25T11:49:03.000+0200}, title = {Module packing based on the BSG-structure and IC layout applications.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad17.html#NakatakeFMK98}, volume = 17, year = 1998 }