%0 Conference Paper %1 conf/3dic/MurugesanFBLKIK14 %A Murugesan, Mariappan %A Fukushima, Takafumi %A Bea, Ji Chel %A Lee, K. W. %A Koyanagi, Mitsu %A Imai, Y. %A Kimura, S. %A Tanaka, Tetsu %B 3DIC %D 2014 %I IEEE %K dblp %P 1-4 %T Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#MurugesanFBLKIK14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/MurugesanFBLKIK14, added-at = {2019-10-19T00:00:00.000+0200}, author = {Murugesan, Mariappan and Fukushima, Takafumi and Bea, Ji Chel and Lee, K. W. and Koyanagi, Mitsu and Imai, Y. and Kimura, S. and Tanaka, Tetsu}, biburl = {https://www.bibsonomy.org/bibtex/261320324c77a731ce3c5a053207ccd15/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152158}, interhash = {28e170b1f8f5ead2e94541a2779dbf3b}, intrahash = {61320324c77a731ce3c5a053207ccd15}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-22T16:17:17.000+0200}, title = {Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#MurugesanFBLKIK14}, year = 2014 }