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Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.

M. Murugesan, T. Fukushima, J. Bea, K. Lee, M. Koyanagi, Y. Imai, S. Kimura, and T. Tanaka. 3DIC, page 1-4. IEEE, (2014)

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K W Schulte

Carsten K W Meininghaus

Christoph K W Deinzer

Matthias K W Bandorf

Xavier Lee Lee

Other publications of authors with the same name

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.K. Lee, C. Nagai, A. Nakamura, J. Bea, M. Murugesan, T. Fukushima, T. Tanaka, and M. Koyanagi. 3DIC, page 1-4. IEEE, (2014)Adaptive Service in Mobile Computing EnvironmentsS. Lu, K. Lee, and V. Bharghavan. Proc. of the International Workshop on Quality of Service (IWQoS), page 25--36. New York, USA, (May 1997)Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC.S. Lee, N. Lee, K. Lee, J. Kim, J. Jin, Y. Lee, Y. Hwang, H. Kim, and S. Pae. IRPS, page 1-4. IEEE, (2023)Fall detection algorithm for the elderly using acceleration sensors on the shoes.S. Sim, H. Jeon, G. Chung, S. Kim, S. Kwon, W. Lee, and K. Park. EMBC, page 4935-4938. IEEE, (2011)Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.M. Murugesan, T. Fukushima, J. Bea, K. Lee, M. Koyanagi, Y. Imai, S. Kimura, and T. Tanaka. 3DIC, page 1-4. IEEE, (2014)Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study.M. Murugesan, J. Bea, H. Hashimoto, K. Lee, M. Koyanagi, T. Fukushima, and T. Tanaka. 3DIC, page TS8.10.1-TS8.10.5. IEEE, (2015)Optimal Sizing of Feedforward Neural Networks: Case Studies.K. Lee, and H. Lam. ANNES, page 79-82. IEEE Computer Society, (1995)Robot Space Exploration Using Peano Paths Generated by Self-Organizing Maps.W. Lee, W. Duch, and G. Ng. ICARCV, page 1-6. IEEE, (2006)Optimising neural network weights using genetic algorithms: a case study.K. Lee, and H. Lam. ICNN, page 1384-1388. IEEE, (1995)Roadmap constrained SLAM in neighborhood environment.J. Ibañez-Guzmán, W. Wijesoma, and K. Lee. ICARCV, page 449-454. IEEE, (2004)

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Disambiguation of "Lee, K. W."

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Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.

Please choose a person to relate this publication to

K W Schulte

Carsten K W Meininghaus

Christoph K W Deinzer

Matthias K W Bandorf

Xavier Lee Lee

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lee, K. W."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.

Please choose a person to relate this publication to

K W Schulte

Carsten K W Meininghaus

Christoph K W Deinzer

Matthias K W Bandorf

Xavier Lee Lee

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.