%0 Journal Article %1 journals/corr/abs-1910-06831 %A Hirmer, Katrin %A Casper, Thorben %A Schöps, Sebastian %A Hofmann, Klaus %D 2019 %J CoRR %K dblp %T 3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements. %U http://dblp.uni-trier.de/db/journals/corr/corr1910.html#abs-1910-06831 %V abs/1910.06831

@article{journals/corr/abs-1910-06831, added-at = {2019-10-16T00:00:00.000+0200}, author = {Hirmer, Katrin and Casper, Thorben and Schöps, Sebastian and Hofmann, Klaus}, biburl = {https://www.bibsonomy.org/bibtex/2ed54eb2d54c2e950fba9063faf2d16a1/dblp}, ee = {http://arxiv.org/abs/1910.06831}, interhash = {3b770af9e88ed18d2dda83c6209fe8aa}, intrahash = {ed54eb2d54c2e950fba9063faf2d16a1}, journal = {CoRR}, keywords = {dblp}, timestamp = {2019-10-17T11:38:31.000+0200}, title = {3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.}, url = {http://dblp.uni-trier.de/db/journals/corr/corr1910.html#abs-1910-06831}, volume = {abs/1910.06831}, year = 2019 }