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Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique., , , , and . CoRR, (2018)High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition., , , , and . CoRR, (2016)Determination of Bond Wire Failure Probabilities in Microelectronic Packages., , and . CoRR, (2016)Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging., , , and . Comput. Math. Appl., 79 (6): 1781-1801 (2020)3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements., , , and . CoRR, (2019)Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models., , and . CoRR, (2016)Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems., , , and . CoRR, (2018)Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging., , , and . CoRR, (2018)Electrothermal simulation of bonding wire degradation under uncertain geometries., , , , , , and . DATE, page 1297-1302. IEEE, (2016)