%0 Journal Article %1 journals/tcad/CongHKP01 %A Cong, Jason %A He, Lei %A Koh, Cheng-Kok %A Pan, David Zhigang %D 2001 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 9 %P 1164-1169 %T Interconnect sizing and spacing with consideration of couplingcapacitance. %U http://dblp.uni-trier.de/db/journals/tcad/tcad20.html#CongHKP01 %V 20

@article{journals/tcad/CongHKP01, added-at = {2020-09-24T00:00:00.000+0200}, author = {Cong, Jason and He, Lei and Koh, Cheng-Kok and Pan, David Zhigang}, biburl = {https://www.bibsonomy.org/bibtex/227ed6c672eea8bceee6bed3660d74779/dblp}, ee = {https://doi.org/10.1109/43.945311}, interhash = {401a34eec42f8c1883e8841eb5ce1a87}, intrahash = {27ed6c672eea8bceee6bed3660d74779}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, number = 9, pages = {1164-1169}, timestamp = {2020-09-25T11:49:34.000+0200}, title = {Interconnect sizing and spacing with consideration of couplingcapacitance.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad20.html#CongHKP01}, volume = 20, year = 2001 }