%0 Conference Paper %1 conf/cicc/KnickerbockerPA05 %A Knickerbocker, John U. %A Patel, Chirag S. %A Andry, Paul S. %A Tsang, Cornelia K. %A Buchwalter, L. Paivikki %A Sprogis, Edmund J. %A Gan, Hua %A Horton, Raymond R. %A Polastre, Robert J. %A Wright, Steven L. %A Schuster, Christian D. %A Baks, Christian W. %A Doany, Fuad E. %A Rosner, Joanna %A Cordes, Steven %B CICC %D 2005 %I IEEE %K dblp %P 659-662 %T Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. %U http://dblp.uni-trier.de/db/conf/cicc/cicc2005.html#KnickerbockerPA05 %@ 0-7803-9023-7

@inproceedings{conf/cicc/KnickerbockerPA05, added-at = {2017-05-17T00:00:00.000+0200}, author = {Knickerbocker, John U. and Patel, Chirag S. and Andry, Paul S. and Tsang, Cornelia K. and Buchwalter, L. Paivikki and Sprogis, Edmund J. and Gan, Hua and Horton, Raymond R. and Polastre, Robert J. and Wright, Steven L. and Schuster, Christian D. and Baks, Christian W. and Doany, Fuad E. and Rosner, Joanna and Cordes, Steven}, biburl = {https://www.bibsonomy.org/bibtex/2f957a9649cee779620ab81e2d39fe1cc/dblp}, booktitle = {CICC}, crossref = {conf/cicc/2005}, ee = {https://doi.org/10.1109/CICC.2005.1568756}, interhash = {55bd3540c23d375aa0a0ccd985a08854}, intrahash = {f957a9649cee779620ab81e2d39fe1cc}, isbn = {0-7803-9023-7}, keywords = {dblp}, pages = {659-662}, publisher = {IEEE}, timestamp = {2019-10-17T23:06:40.000+0200}, title = {Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology.}, url = {http://dblp.uni-trier.de/db/conf/cicc/cicc2005.html#KnickerbockerPA05}, year = 2005 }