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%0 Journal Article
%1 journals/mr/ChenTGYS04
%A Chen, C. K.
%A Tan, W. A.
%A Goh, H. S.
%A Yip, Y. S.
%A Saw, W. T.
%D 2004
%J Microelectron. Reliab.
%K dblp
%N 9-11
%P 1281-1285
%T Full ball shear metrology as defect detection and analysis tool for solder joint reliability assessment on direct immersion gold technology.
%U http://dblp.uni-trier.de/db/journals/mr/mr44.html#ChenTGYS04
%V 44
@article{journals/mr/ChenTGYS04,
added-at = {2020-02-22T00:00:00.000+0100},
author = {Chen, C. K. and Tan, W. A. and Goh, H. S. and Yip, Y. S. and Saw, W. T.},
biburl = {https://www.bibsonomy.org/bibtex/2192db0fe8567a4783af3b79f8daaa375/dblp},
ee = {https://doi.org/10.1016/j.microrel.2004.07.010},
interhash = {96370b56ef79de32c7e7a9f1c77ec75a},
intrahash = {192db0fe8567a4783af3b79f8daaa375},
journal = {Microelectron. Reliab.},
keywords = {dblp},
number = {9-11},
pages = {1281-1285},
timestamp = {2020-02-25T13:26:49.000+0100},
title = {Full ball shear metrology as defect detection and analysis tool for solder joint reliability assessment on direct immersion gold technology.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr44.html#ChenTGYS04},
volume = 44,
year = 2004
}