%0 Journal Article %1 journals/mr/ChenTGYS04 %A Chen, C. K. %A Tan, W. A. %A Goh, H. S. %A Yip, Y. S. %A Saw, W. T. %D 2004 %J Microelectron. Reliab. %K dblp %N 9-11 %P 1281-1285 %T Full ball shear metrology as defect detection and analysis tool for solder joint reliability assessment on direct immersion gold technology. %U http://dblp.uni-trier.de/db/journals/mr/mr44.html#ChenTGYS04 %V 44

@article{journals/mr/ChenTGYS04, added-at = {2020-02-22T00:00:00.000+0100}, author = {Chen, C. K. and Tan, W. A. and Goh, H. S. and Yip, Y. S. and Saw, W. T.}, biburl = {https://www.bibsonomy.org/bibtex/2192db0fe8567a4783af3b79f8daaa375/dblp}, ee = {https://doi.org/10.1016/j.microrel.2004.07.010}, interhash = {96370b56ef79de32c7e7a9f1c77ec75a}, intrahash = {192db0fe8567a4783af3b79f8daaa375}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {9-11}, pages = {1281-1285}, timestamp = {2020-02-25T13:26:49.000+0100}, title = {Full ball shear metrology as defect detection and analysis tool for solder joint reliability assessment on direct immersion gold technology.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr44.html#ChenTGYS04}, volume = 44, year = 2004 }