%0 Journal Article %1 journals/mr/WangTLL13 %A Wang, Tong Hong %A Tsai, Ching-I %A Lee, Chang-Chi %A Lai, Yi-Shao %D 2013 %J Microelectron. Reliab. %K dblp %N 2 %P 297-302 %T Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. %U http://dblp.uni-trier.de/db/journals/mr/mr53.html#WangTLL13 %V 53

@article{journals/mr/WangTLL13, added-at = {2020-02-22T00:00:00.000+0100}, author = {Wang, Tong Hong and Tsai, Ching-I and Lee, Chang-Chi and Lai, Yi-Shao}, biburl = {https://www.bibsonomy.org/bibtex/26820fa1a36dba0d057d0fbbfa5096dab/dblp}, ee = {https://doi.org/10.1016/j.microrel.2012.08.006}, interhash = {b3e3bb3705318e6612804c6750096ed9}, intrahash = {6820fa1a36dba0d057d0fbbfa5096dab}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 2, pages = {297-302}, timestamp = {2020-02-25T13:28:02.000+0100}, title = {Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr53.html#WangTLL13}, volume = 53, year = 2013 }