%0 Conference Paper %1 conf/irps/KteyanHCS19 %A Kteyan, Armen %A Hovsepyan, Henrik %A Choy, Jun-Ho %A Sukharev, Valeriy %B IRPS %D 2019 %I IEEE %K dblp %P 1-7 %T Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages. %U http://dblp.uni-trier.de/db/conf/irps/irps2019.html#KteyanHCS19 %@ 978-1-5386-9504-3

@inproceedings{conf/irps/KteyanHCS19, added-at = {2019-05-31T00:00:00.000+0200}, author = {Kteyan, Armen and Hovsepyan, Henrik and Choy, Jun-Ho and Sukharev, Valeriy}, biburl = {https://www.bibsonomy.org/bibtex/2f1aba94bb1b7dd949dc56cb96165079b/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2019}, ee = {https://doi.org/10.1109/IRPS.2019.8720471}, interhash = {b7995ba326ad08fc989b33ef59afc1d4}, intrahash = {f1aba94bb1b7dd949dc56cb96165079b}, isbn = {978-1-5386-9504-3}, keywords = {dblp}, pages = {1-7}, publisher = {IEEE}, timestamp = {2019-10-17T14:45:22.000+0200}, title = {Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2019.html#KteyanHCS19}, year = 2019 }