%0 Conference Paper %1 conf/3dic/KikuchiKNNAYK13 %A Kikuchi, Katsuya %A Kato, Fumiki %A Nemoto, Shunsuke %A Nakagawa, Hiroshi %A Aoyagi, Masahiro %A Yasu, Youtaro %A Koshiji, Kohji %B 3DIC %D 2013 %I IEEE %K dblp %P 1-4 %T Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#KikuchiKNNAYK13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/KikuchiKNNAYK13, added-at = {2018-11-02T00:00:00.000+0100}, author = {Kikuchi, Katsuya and Kato, Fumiki and Nemoto, Shunsuke and Nakagawa, Hiroshi and Aoyagi, Masahiro and Yasu, Youtaro and Koshiji, Kohji}, biburl = {https://www.bibsonomy.org/bibtex/243539202f84078ba4eac2b480cb712b0/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702401}, interhash = {be081f0c93b64380705bc07bcc531cc8}, intrahash = {43539202f84078ba4eac2b480cb712b0}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#KikuchiKNNAYK13}, year = 2013 }