Author of the publication

Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging.

, , , , , , and . 3DIC, page 1-4. IEEE, (2013)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

No persons found for author name Koshiji, Kohji
add a person with the name Koshiji, Kohji
 

Other publications of authors with the same name

Heightening upper limit frequency of wideband antenna using asymmetrical radiating elements., , and . GCCE, page 444-445. IEEE, (2015)Analysis of Current Density and Specific Absorption Rate in Biological Tissue Surrounding an Air-core Type of Transcutaneous Transformer for an Artificial Heart., , , and . EMBC, page 5392-5395. IEEE, (2006)Current distribution analyses of figure-eight coil for an intergrated transcutaneous energy and information transmission system for a totally-implantable artificial heart., , and . ISMICT, page 1-4. IEEE, (2019)Energy Transmission Transformer for a Wireless Capsule Endoscope: Analysis of Specific Absorption Rate and Current Density in Biological Tissue., , , and . IEEE Trans. Biomed. Eng., 55 (7): 1864-1871 (2008)Suppression of Undesired Reflection Using a Spatial Filtering on Bistatic Radar Cross Section Measurements within a Near Zone., and . IEICE Trans. Commun., 91-B (6): 2077-2080 (2008)Transmission characteristics through the bent arm wearing magnetically-coupled coils for body area communication., , and . GCCE, page 481-482. IEEE, (2015)Development of a high-hydrous gel phantom for human body communication based on electrical anisotropy., , , , and . EMBC, page 4028-4031. IEEE, (2019)Analysis of Current Density and Specific Absorption Rate in Biological Tissue Surrounding Transcutaneous Transformer for an Artificial Heart., , , and . IEEE Trans. Biomed. Eng., 55 (1): 205-213 (2008)A study on transmission characteristics and specific absorption rate using impedance-matched electrodes for various human body communication., , and . EMBC, page 1883-1886. IEEE, (2013)Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging., , , , , , and . 3DIC, page 1-4. IEEE, (2013)