%0 Journal Article %1 journals/mr/HermsWW16 %A Herms, Martin %A Wagner, Matthias %A Wolf, Ingrid De %D 2016 %J Microelectron. Reliab. %K dblp %P 330-335 %T Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy. %U http://dblp.uni-trier.de/db/journals/mr/mr64.html#HermsWW16 %V 64

@article{journals/mr/HermsWW16, added-at = {2022-03-28T00:00:00.000+0200}, author = {Herms, Martin and Wagner, Matthias and Wolf, Ingrid De}, biburl = {https://www.bibsonomy.org/bibtex/2b933f19cee94c2ab2f1fecb6d1ba4fe1/dblp}, ee = {https://doi.org/10.1016/j.microrel.2016.07.035}, interhash = {eec38452bc1ade51980045b946b237f4}, intrahash = {b933f19cee94c2ab2f1fecb6d1ba4fe1}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {330-335}, timestamp = {2024-04-09T02:50:13.000+0200}, title = {Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr64.html#HermsWW16}, volume = 64, year = 2016 }