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Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy.

, , and . Microelectron. Reliab., (2016)

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Wafer-Level Aging of InGaAs/GaAs Nano-Ridge p-i-n Diodes Monolithically Integrated on Silicon., , , , , , , , , and . IRPS, page 9. IEEE, (2022)Impact of Mechanical Stress on the Electrical Performance of 3D NAND., , , , , , and . IRPS, page 1-5. IEEE, (2019)MEMS reliability.. Microelectron. Reliab., 43 (7): 1047-1048 (2003)Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters., , , , , , , and . IRPS, page 1-7. IEEE, (2023)Light-Assisted Investigation of the Role of Oxygen Flow during IGZO Deposition on Deep Subgap States and their Evolution Under PBTI., , , , , , , , , and 1 other author(s). IRPS, page 1-6. IEEE, (2024)Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects., , , , , , , , , and 1 other author(s). Microelectron. Reliab., (2017)Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations., , , , , and . IRPS, page 1-7. IEEE, (2023)Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors., , , and . Microelectron. Reliab., 50 (9-11): 1383-1387 (2010)Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator., , , , , and . PSC, page 1-3. IEEE, (2023)On the impact of mechanical stress on gate oxide trapping., , , , , , , , and . IRPS, page 1-5. IEEE, (2020)