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%0 Conference Paper
%1 conf/irps/LeeLLKJLHKP23
%A Lee, S.
%A Lee, N.-H.
%A Lee, K. W.
%A Kim, J. H.
%A Jin, J. H.
%A Lee, Y. S.
%A Hwang, Y. C.
%A Kim, H. S.
%A Pae, S.
%B IRPS
%D 2023
%I IEEE
%K dblp
%P 1-4
%T Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC.
%U http://dblp.uni-trier.de/db/conf/irps/irps2023.html#LeeLLKJLHKP23
%@ 978-1-6654-5672-2
@inproceedings{conf/irps/LeeLLKJLHKP23,
added-at = {2023-05-24T00:00:00.000+0200},
author = {Lee, S. and Lee, N.-H. and Lee, K. W. and Kim, J. H. and Jin, J. H. and Lee, Y. S. and Hwang, Y. C. and Kim, H. S. and Pae, S.},
biburl = {https://www.bibsonomy.org/bibtex/2c466b0678a02ac6657efebc0bbcbcd41/dblp},
booktitle = {IRPS},
crossref = {conf/irps/2023},
ee = {https://doi.org/10.1109/IRPS48203.2023.10117889},
interhash = {fc36106cf9c48cfd6ea9f0422b43c7eb},
intrahash = {c466b0678a02ac6657efebc0bbcbcd41},
isbn = {978-1-6654-5672-2},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2024-04-09T12:18:52.000+0200},
title = {Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC.},
url = {http://dblp.uni-trier.de/db/conf/irps/irps2023.html#LeeLLKJLHKP23},
year = 2023
}