%0 Conference Paper %1 conf/3dic/NishizawaASSI13 %A Nishizawa, S. %A Arima, Ryohei %A Shimizu, Tomohiro %A Shingubara, Shoso %A Inoue, Fumihiro %B 3DIC %D 2013 %I IEEE %K dblp %P 1-4 %T Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#NishizawaASSI13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/NishizawaASSI13, added-at = {2017-05-21T00:00:00.000+0200}, author = {Nishizawa, S. and Arima, Ryohei and Shimizu, Tomohiro and Shingubara, Shoso and Inoue, Fumihiro}, biburl = {https://www.bibsonomy.org/bibtex/23ed9ffb7fdfcfa7ed970b29f929e29fa/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702392}, interhash = {f35ae4b62eec4e41513b318609955d9b}, intrahash = {3ed9ffb7fdfcfa7ed970b29f929e29fa}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#NishizawaASSI13}, year = 2013 }