%0 Journal Article %1 journals/tcas/ReddyAK20 %A Reddy, Raviteja P. %A Acharyya, Amit %A Khursheed, S. Saqib %D 2020 %J IEEE Trans. Circuits Syst. %K dblp %N 11 %P 2677-2681 %T A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design. %U http://dblp.uni-trier.de/db/journals/tcas/tcasII67.html#ReddyAK20 %V 67-II

@article{journals/tcas/ReddyAK20, added-at = {2020-12-17T00:00:00.000+0100}, author = {Reddy, Raviteja P. and Acharyya, Amit and Khursheed, S. Saqib}, biburl = {https://www.bibsonomy.org/bibtex/25504a3a1d569d480879be964b64f5248/dblp}, ee = {https://doi.org/10.1109/TCSII.2020.2970724}, interhash = {aece463accffbc2c783cafb3729b8a1a}, intrahash = {5504a3a1d569d480879be964b64f5248}, journal = {IEEE Trans. Circuits Syst.}, keywords = {dblp}, number = 11, pages = {2677-2681}, timestamp = {2024-04-09T06:14:49.000+0200}, title = {A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design.}, url = {http://dblp.uni-trier.de/db/journals/tcas/tcasII67.html#ReddyAK20}, volume = {67-II}, year = 2020 }