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A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design.

, , and . IEEE Trans. Circuits Syst., 67-II (11): 2677-2681 (2020)

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Delay Test for Diagnosis of Power Switches., , , , and . IEEE Trans. Very Large Scale Integr. Syst., 22 (2): 197-206 (2014)A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design., , and . IEEE Trans. Circuits Syst., 67-II (11): 2677-2681 (2020)Bridge Defect Diagnosis for Multiple-Voltage Design., , , , and . ETS, page 99-104. IEEE Computer Society, (2008)A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors., , and . ITC-Asia, page 121-126. IEEE, (2019)Leakage Current Analysis for Diagnosis of Bridge Defects in Power-Gating Designs., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (4): 883-895 (2018)Efficient Static Compaction Techniques for Sequential Circuits Based on Reverse-Order Restoration and Test Relaxation., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 25 (11): 2556-2564 (2006)Differential Aging Sensor to Detect Recycled ICs using Sub-threshold Leakage Current., , , and . DATE, page 1500-1503. IEEE, (2021)Secure Scan Design with a Novel Methodology of Scan Camouflaging., , , and . ECCTD, page 1-4. IEEE, (2020)Efficient test compaction for combinational circuits based on Fault detection count-directed clustering., and . IET Comput. Digit. Tech., 1 (4): 364-368 (2007)BTI and leakage aware dynamic voltage scaling for reliable low power cache memories., , , and . IOLTS, page 194-199. IEEE, (2015)