%0 Conference Paper %1 conf/ets/MetzlerTBDGV12 %A Metzler, Carolina %A Todri, Aida %A Bosio, Alberto %A Dilillo, Luigi %A Girard, Patrick %A Virazel, Arnaud %B ETS %D 2012 %I IEEE Computer Society %K dblp %P 1 %T Through-Silicon-Via resistive-open defect analysis. %U http://dblp.uni-trier.de/db/conf/ets/ets2012.html#MetzlerTBDGV12 %@ 978-1-4673-0697-3

@inproceedings{conf/ets/MetzlerTBDGV12, added-at = {2023-03-21T00:00:00.000+0100}, author = {Metzler, Carolina and Todri, Aida and Bosio, Alberto and Dilillo, Luigi and Girard, Patrick and Virazel, Arnaud}, biburl = {https://www.bibsonomy.org/bibtex/28257973d65787453477ae3d22b9f2703/dblp}, booktitle = {ETS}, crossref = {conf/ets/2012}, ee = {https://doi.org/10.1109/ETS.2012.6233037}, interhash = {4086bf0309a3f92000c575c5f7a77601}, intrahash = {8257973d65787453477ae3d22b9f2703}, isbn = {978-1-4673-0697-3}, keywords = {dblp}, pages = 1, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T20:48:44.000+0200}, title = {Through-Silicon-Via resistive-open defect analysis.}, url = {http://dblp.uni-trier.de/db/conf/ets/ets2012.html#MetzlerTBDGV12}, year = 2012 }