Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Journal Article
%1 journals/mr/PedersenNCKIPP17
%A Pedersen, Kristian Bonderup
%A Nielsen, Dennis A.
%A Czerny, Bernhard
%A Khatibi, Golta
%A Iannuzzo, Francesco
%A Popok, Vladimir N.
%A Pedersen, Kjeld
%D 2017
%J Microelectron. Reliab.
%K dblp
%P 373-377
%T Wire bond degradation under thermo- and pure mechanical loading.
%U http://dblp.uni-trier.de/db/journals/mr/mr76.html#PedersenNCKIPP17
%V 76-77
@article{journals/mr/PedersenNCKIPP17,
added-at = {2023-09-30T00:00:00.000+0200},
author = {Pedersen, Kristian Bonderup and Nielsen, Dennis A. and Czerny, Bernhard and Khatibi, Golta and Iannuzzo, Francesco and Popok, Vladimir N. and Pedersen, Kjeld},
biburl = {https://www.bibsonomy.org/bibtex/2a001cd71176d1a161766c3d18b81771a/dblp},
ee = {https://doi.org/10.1016/j.microrel.2017.07.055},
interhash = {4f6f7dc75411d9cd08edb96289ee2144},
intrahash = {a001cd71176d1a161766c3d18b81771a},
journal = {Microelectron. Reliab.},
keywords = {dblp},
pages = {373-377},
timestamp = {2024-04-09T02:49:44.000+0200},
title = {Wire bond degradation under thermo- and pure mechanical loading.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr76.html#PedersenNCKIPP17},
volume = {76-77},
year = 2017
}