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Isothermal bending fatigue response of solder joints in high power semiconductor test structures., and . Microelectron. Reliab., (2017)Assessment of mechanical reliability of surface mounted capacitor by an accelerated shear fatigue test technique., and . Microelectron. Reliab., 54 (9-10): 1764-1769 (2014)Aluminum bond-wire properties after 1 billion mechanical cycles., , , , , and . Microelectron. Reliab., 43 (9-11): 1833-1838 (2003)Interface reliability and lifetime prediction of heavy aluminum wire bonds., and . Microelectron. Reliab., (2016)A novel accelerated test technique for assessment of mechanical reliability of solder interconnects., , , and . Microelectron. Reliab., 49 (9-11): 1283-1287 (2009)Fatigue testing method for fine bond wires in an LQFP package., , , , and . Microelectron. Reliab., (2016)Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects., , , and . Microelectron. Reliab., 53 (9-11): 1558-1562 (2013)Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl., and . Microelectron. Reliab., (2018)Delamination of polyimide/Cu films under mixed mode loading., , and . Microelectron. Reliab., (2016)Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions., , , , , and . Microelectron. Reliab., 52 (9-10): 2353-2357 (2012)